Products


ReverseLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)


  

The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.

e tec
E tec

 

 

Part Number

BER####-08E#-######55L#

 

 

Related documents

 

Keywords : BER####-08E#-######55L#, ReverseLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)