Products


Open Clamshell Alu (< 200 contacts)Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)


  

The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.

e tec
E tec

 

 

Part Number

BUH####-127#-#######5#

 

 

Related documents

 

Keywords : BUH####-127#-#######5#, Open Clamshell Alu (< 200 contacts)Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)